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Current transport and capacitance-voltage characteristics of GaAs and InP nanometer-sized Schottky contacts formed by in situ electrochemical process

机译:原位电化学过程形成的GaAs和InP纳米肖特基接触的电流传输和电容电压特性

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摘要

The electrical properties of nanometer-sized Schottky contacts which were successfully formed on n-GaAs and n-InP substrates by a combination of an electrochemical process and an electron-beam (EB) lithography, were characterized both experimentally and theoretically. The detailed I–V measurements using a conductive AFM system showed nonlinear log I–V characteristics with large n value in range of 1.2–2.0 which cannot be explained by a standard 1D thermionic emission model. A computer simulation showed that this nonlinear characteristics can be explained by a new 3D thermionic emission model where Fermi-level pinning on the surrounding free surface modifies the potential distribution underneath the nano-contact. Calculation of C–V characteristics showed an extremely small change of the depletion layer width with bias due to the environmental Fermi-level pinning. On the other hand, it was also found that Fermi-level pinning at the metal–semiconductor interface itself is greatly reduced, resulting in a strong dependence of barrier height on the metal workfunction.
机译:通过电化学和电子束(EB)光刻技术的结合,成功地在n-GaAs和n-InP衬底上形成了纳米级肖特基接触的电学特性,在实验和理论上进行了表征。使用导电AFM系统进行的详细IV测量显示非线性log I-V特性,n值在1.2-2.0范围内,这不能用标准的一维热电子发射模型来解释。计算机仿真表明,这种非线性特性可以通过新的3D热电子发射模型来解释,该模型在周围自由表面上的费米能级钉扎可修改纳米接触下的电势分布。 C–V特性的计算表明,由于环境费米能级钉扎,耗尽层宽度随偏压的变化非常小。另一方面,还发现金属-半导体界面本身的费米能级钉扎大大减少,导致势垒高度对金属功函数的强烈依赖性。

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